Macronix, Qimonda Reach Advanced Flash Memory Cooperation Deal
January 11, 2008
In continuation of the announcement made by Macronix - a Taiwanese provider of NVM (Non-Volatile Memory) solutions - as reported in an Asia Express dated December 28, 2007, the company has finalized a five-year cooperation agreement with Germany-based Qimonda on January 3 to jointly develop advanced flash memory process technologies, Taiwan's Economic Daily News reported.
Both parties are expected to initially inject approximately USS$150 million to US$200 million in the project, according to the same source. To be based in Qimonda's existing R&D and 300mm wafer production facility in Dresden, Germany, the cooperation is projected to focus on the development of various NVM technologies. Products will be manufactured using sub-40nm process technologies instead of 45nm or newer technologies as initially expected. Effect of this cooperation is expected to materialize in 2010.
Also, the two companies plan to cooperate on further NVM development leveraging Macronix's proprietary BESONOS (Bandgap Engineered Silicon Oxide Nitric Oxide Silicon) technology, which is viewed as an alternative to the NAND flash technology.